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Exhibitions Japan Tokyo IC & Sensor Packaging Technology Expo (ICP) 2020

IC & Sensor Packaging Technology Expo (ICP) 2020 - international Exhibition of Design and Production of IP Enclosures

IC & Sensor Packaging Technology Expo (ICP) 2020 - international Exhibition of Design and Production of IP Enclosures

from 15 to Jan. 17, 2020
Japan, Tokyo, Tokyo Big Sight

About the exhibition IC & Sensor Packaging Technology Expo (ICP) 2020

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Additional information and services:
Exhibited products:
Building technologies, equipment and tools
Building materials
Metal and steel elements in building construction
Doors, windows, shutters
Finished building constructions, panels
Ventilation systems
Water supply and sewage systems
Paints, coatings
Security, access control systems
Opening hours:
10am - 6pm, last day 10am - 5pm
Organizer:
Reed Exhibitions Japan Ltd.
Website:
visit the exhibition website

History:

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