IC & Sensor Packaging Technology Expo (ICP) 2022 - международная выставка проектирования и производства корпусов ИС

The exhibition IC & Sensor Packaging Technology Expo (ICP) 2022 will take place from 19 to January 21 in Tokyo, Japan.

Key thematic areas: Электроника, Электронные компоненты, Микроэлектроника, Интегральные схемы и системы.

A detailed list of exhibits and exhibition sections can be found in the “Additional Information” section. The business program is usually published closer to the event dates.

Planning to participate in IC & Sensor Packaging Technology Expo (ICP) 2022?

If you have a specific question about the event, please visit the organizer’s website listed in the “Additional Information” section or search for it via Yandex or Google.

Directions to the exhibition center Tokyo Big Sight can be found in the venues catalog or on the official website of the complex. You can conveniently plan your route using Google Maps or Yandex Maps.

Before attending, please confirm the dates and venue on the official resources — changes or rescheduling may occur. Expomap is not responsible for possible inaccuracies in the published data.

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